Our partner Fiberthree is launching the F3 PA ESD filament

Our partner Fiberthree is launching the F3 PA ESD filament, a carbon-fiber-filled polyamide (PA-CF) filament designed for electrostatic discharge (ESD) applications, at Formnext 2024. After three years of development and over 34 formulations, it offers a surface resistance of 10⁵ to 10⁷ Ω/cm, meeting DIN EN 61340-5 standards. It delivers tensile strength of 84 MPa and consistent conductivity across horizontal and vertical planes, surpassing other ESD materials.

Compatible with FFF printers and industrial machines, it supports versatile applications, including combining conductive and non-conductive structures in a single print. Available in multiple spool sizes, Fiberthree also announced a forthcoming high-conductivity filament for sensor and circuit trace printing, further expanding its advanced materials portfolio.

3D printed tray using F3 PA ESD filament. Image via Fiberthree.

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